GIGABYTE unveils its Motherboard Digital Power Engine @ CES 2012
GIGABYTE has announced its participation at the Consumer Electronics Show (CES) in Las Vegas where it is debuting a number of new motherboard technologies that will be central to its motherboard design in 2012 and beyond. International media and customers get a sneak peak of GIGABYTE's new technologies at their suite in The Venetian Hotel, Las Vegas, from January 10th - 13th.
GIGABYTE is showing forthcoming 7 series motherboards featuring the CPU power delivery with GIGABYTE's Digital Power Engine called 3D Power. Offering digital control over all the main onboard power zones, this new digital PWM design allows users to manipulate and monitor the power provided to 2nd-Gen Intel Core and Next-Gen processors for the LGA 1155 socket.
"We are very excited about the new technologies that will feature on our 7 series motherboards, and are confident that our customers will find them, together with the performance and feature improvements on Intel's future GIGABYTE GA-Z77X-UD5H Motherboard with 3D Power platform, extremely appealing. Product development and debugging for the new features is progressing really well, and we expect to have a full range of products available globally by launch day," said Henry Kao, Vice-President, GIGABYTE Motherboard Business Unit.
Visitors to CES 2012 will be able to see the second-iteration of GIGABYTE's revolutionary 3D BIOS that is based on GIGABYTE UEFI DualBIOS technology.
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