PTI acquired NEXX Stratus Plating Tool
NEXX Systems (NEXX) has sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology (PTI).
The Stratus claimed to be used for copper pillar bumps and re-distribution layers in advanced packaging applications that enable portable intelligent devices, such as smart phones and tablet PCs. The Stratus platform is also being evaluated as part of PTI's aggressive TSV commercialization program.
Scott Jewler, Sr. GM, PTI said, "PTI delivers cutting-edge process technologies in a high volume manufacturing environment to major integrated device manufacturers and fabless companies. NEXX Systems' Stratus will enable PTI to provide premiere technology solutions, such as copper pillar bumps passing the benefits of a flexible system with exceptional costs of ownership onto our customers as cost savings."
Tom Walsh, CEO, NEXX said, "We are delighted to support PTI in their delivery of exceptionally reliable advanced packaging solutions to the marketplace. I believe PTI is leading the industry in making thinner, lighter and more efficient electronic devices by implementing advanced packaging solutions in high volume production. NEXX is proud to be part of the exceptional quality standards at PTI's world class manufacturing facilities."
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