VIA unveils Latest COM Express
VIA Technologies has announced the latest VIA COMe-8X90 module, featuring 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP).
Measuring 95mm x 125mm, COM (Computer-on-Module) Express is an embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board.
Along with the VIA COMe-8X90module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to rapidly customize their solutions.
"Embedded modules are ideal for creating highly tailored solutions with a short time to market approach. The VIA COMe-8X90module provides customers with an easily customizable platform with power-efficient processing and rich I/O options, allowing them to quickly create optimized products for their target markets," said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc.
The VIA COMe-8X90 module will be on display at the VIA Embedded booth in Hall 1 of the Embedded World 2012 Exhibition and Conference, which is being held in Nuremberg, Germany from February 28 to March 1, 2012. In addition, VIA will be presenting the latest embedded Android and x86 multi-core solutions for embedded applications.
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