Realme X50 5G phone with Snapdragon 765G, dual punch-hole display teased [Update: Liquid Cooling, 70% charge in 30 min with VOOC 4.0]
Update: December 20, 2019 — realme has confirmed that X50 5G will feature 8mm 410mm³ diameter large liquid-cooled copper tube for heat dissipation 3.0 offering five-dimensional heat dissipation that covers all the heat sources 100%. It will feature VOOC flash charge 4.0, so that the phone is charged from 0 to 70% in 30 minutes. Update: December 10, 2019 — realme China CMO Xu Qi Chase just confirmed that the X50 5G will be powered by Snapdragon 765G SoC. The image also shows the dual punch-hole screen clearly in the top left corner. Earlier: realme already confirmed that it will launch a 5G phone this year, and recently at the realme X2 Pro launch event Madhav Seth, Chief Executive Officer, Realme India confirmed that realme will be one of the first brands to launch Qualcomm SoCs with built-in 5G in India in 2020. Today, realme China CMO Xu Qi Chase has confirmed that realme will launch the X50 5G phone in China soon. This comes after the realme X2 Pro was launched in China and Europe in October and in India last week. He has also confirmed that the phone will come with support for 5G stand alone and non-stand alone (SA/NSA) sub-6GHz ... 
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